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The Innovation and Technology Commission (ITC) is now inviting applications under Tier 2 and Tier 3 of the Innovation and Technology Support Programme (ITSP) under the Innovation and Technology Fund (ITF).
ITSP adopts a three-tier funding framework. Tier 1 provides funding for research and development (R&D) projects in selected focus areas undertaken by the five R&D Centres set up under ITF. Tier 2 offers funding for applied R&D projects which are industry-oriented and have good potential for commercialisation, while Tier 3 provides funding for exploratory and forward-looking R&D projects.
The application period begins today (March 1) and will last until April 29, 2011.
"To enhance the assessment framework for ITSP, we have introduced new application forms and revised the Application Guide", said an ITC spokesman. "We will launch two rounds of ITSP application in 2011 to encourage research institutes to undertake more applied R&D projects."
The application forms and the Application Guide are available at www.itf.gov.hk. For further information, please contact the ITF Secretariat on 20/F, Wu Chung House, 213 Queen's Road East, Wan Chai, Hong Kong (tel: 2737 2229; fax: 2957 8726; email: enquiry@itf.gov.hk ).
Ends/Tuesday, March 1, 2011
Issued at HKT 20:25
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