The Innovation and Technology Commission (ITC) is now inviting funding applications under the Innovation and Technology Support Programme (ITSP) of the Innovation and Technology Fund (ITF).
      
     The ITSP adopts a three-tier funding framework. This application exercise covers Tier 2 and Tier 3 funding. Tier 2 involves the funding of applied research and development projects that are industry-oriented and have potential for commercialisation, while Tier 3 involves the funding of exploratory and forward-looking projects. 
                 
     "For this round we would in particular like to receive proposals under the themes of 'Healthy Ageing', 'Smart City', 'Robotics' and 'FinTech'. However, proposals not falling under these themes would also be accepted," a spokesman for the ITC said.
                
     The application period commenced today (July 29) and will last until September 30 this year.
       
     ýÿFurther information and application procedures on the ITSP funding schemes are available on the ITF website and can be obtained from the ITF Secretariat at 21/F, West Wing, Central Government Offices, 2 Tim Mei Avenue, Tamar, Hong Kong (Tel: 3655 5725; fax: 2957 8726; email: enquiry@itf.gov.hk).

Ends/Friday, July 29, 2016
Issued at HKT 12:00

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