The following is issued on behalf of the Hong Kong Monetary Authority:
 
     The Hong Kong Monetary Authority (HKMA), as representative of the Hong Kong Special Administrative Region Government (HKSAR Government), announced that a tender for 3-year RMB institutional Government Bonds (issue number 03GB2710002) under the Infrastructure Bond Programme was held today (October 24).

     A total of RMB1.0 billion 3-year Government Bonds were offered today. A total of RMB7.212 billion tender applications were received. The bid-to-cover ratio, i.e. the ratio of bonds applied for to bonds issued, is 7.21. The average price accepted is 100.54, implying an annualised yield of 1.953 pre cent.
 
HKSAR Institutional Government Bonds Tender Results
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     Tender results of 3-year RMB HKSAR Institutional Government Bonds:
 

Tender Date	:	October 24, 2024
Issue Number	:	03GB2710002
Stock Code	:	84574 (HKGB2.13 2710-R)
Issue and Settlement Date	:	October 28, 2024
Tenor	:	3 years
Maturity Date	:	October 28, 2027
Coupon Rate	:	2.13 per cent
Amount Applied	:	RMB7.212 billion
Amount Allotted	:	RMB1.0 billion
Bid-to-Cover Ratio*	:	7.21
Average Price Accepted (Yield)	:	100.54 (1.953 per cent)
Lowest Price Accepted (Yield)	:	100.29 (2.040 per cent)
Pro-rata Ratio	:	About 45 per cent
Average Tender Price (Yield)	:	99.99 (2.146 per cent)

* Calculated as the amount of bonds applied for over the amount of bonds issued.

Ends/Thursday, October 24, 2024
Issued at HKT 15:15

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