Tenders invited for site formation and engineering infrastructure works at Hung Shui Kiu/Ha Tsuen New Development Area
***************************************************************
The Civil Engineering and Development Department (CEDD) today (March 8) gazetted a notice to invite tenders for the contract for Hung Shui Kiu/Ha Tsuen New Development Area Second Phase Development - Contract 4 - Site Formation and Engineering Infrastructure Works (Contract No. YL/2023/04). The closing time for the tender is noon on May 3.
The works mainly include:
- site clearance and formation (including land decontamination works) for about 43 hectares of lands, together with provision of associated engineering infrastructure;
- construction of district distributor and local roads connecting Hung Shui Kiu/Ha Tsuen New Development Area to Tin Ha Road;
- construction of pedestrian footbridges;
- construction of a cycle track and pedestrian subway and associated retaining walls;
- revitalisation of some sections of Tin Sam Channel;
- construction of a sewage pumping station;
- construction of associated works including water mains, drainage and sewerage works, district cooling mains, cycle tracks, footpaths, box culverts, landscaping works, electrical and mechanical works and other ancillary works; and
- implementation of environmental mitigation measures (including noise barriers) and environmental monitoring works for the works mentioned above.
The works are scheduled to commence in mid-2024 and will take about 54 months to complete.
The CEDD has commissioned Ove Arup & Partners Hong Kong Limited to design and supervise the works. Interested contractors may obtain the forms of tender and further particulars from the company at Level 5, Festival Walk, 80 Tat Chee Avenue, Kowloon Tong.
Details of the tender notice are available on the CEDD website (www.cedd.gov.hk/eng/tender-notices/contracts/tender-notices/index.html). For enquiries, please call Ove Arup & Partners Hong Kong Limited at 2268 3400 during office hours.
Ends/Friday, March 8, 2024
Issued at HKT 11:10
NNNN