The following is issued on behalf of the Legislative Council Secretariat:

     The Legislative Council (LegCo) Panel on Information Technology and Broadcasting conducted a site visit to the Hong Kong Science Park today (March 3) to gain understanding of the Government's efforts in promoting the development of innovation and technology in Hong Kong.

     Accompanied by the Chairperson of the Hong Kong Science and Technology Parks Corporation (HKSTP), Mrs Fanny Law, and the Under Secretary for Innovation and Technology, Dr David Chung, Members received briefings by the Chief Executive Officer of HKSTP, Mr Albert Wong; the Chief Executive Officer of the Nano and Advanced Materials Institute, Mr Daniel Yu; and the Chief Technology Officer of the Hong Kong Applied Science and Technology Research Institute, Dr Ieong Mei-kei, on their latest initiatives in supporting local technology start-ups.

     After the briefings, Members visited two thematic collaborative work spaces, namely the Data Studio and the Robotics Garage, to learn about the business and technical assistance provided by HKSTP to facilitate the use of open data and the development of robotics technology. They also discussed with a representative of HKSTP incubatees on how to turn the research and development deliverables into business opportunities.

     Members also took the opportunity to visit the Ming Wai Lau Centre for Reparative Medicine (the Centre) to learn about its latest research projects in stem cell biology and regenerative medicine. The Centre, which was established in October last year, is the first centre set up by Sweden's Karolinska Institutet overseas. Members then attended a lunch with representatives of HKSTP to exchange views on issues of mutual concern.

     Members participating in the visit included the Chairman and Deputy Chairman of the Panel, Dr Elizabeth Quat and Mr Charles Mok; and Panel members Mr Paul Tse, Mr Chan Chi-chuen, Mr Chan Han-pan and Mr Chan Chun-ying; as well as non-Panel member Mr Ho Kai-ming.

Ends/Friday, March 3, 2017
Issued at HKT 19:50

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