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Innovative applied research and development projects are being invited under Tier 3 of the Innovation and Technology Support Programme (ITSP) of Innovation and Technology Fund (ITF).
"Following a review of the operation of the ITF, the Government has adopted a new strategy of innovation and technology development. To implement the new strategy, the Government, in early 2005, adopted a new three-tier structure in funding proposals under the ITSP programme of the ITF," a spokesman for the Innovation and Technology Commission said today (December 30).
Tier 1 will be proposals for the establishment of research & development (R&D) centres to undertake projects in their respective technology areas. The technology areas are automotive parts and accessory systems; logistics and supply chain management enabling technologies; textile and clothing; nanotechnology and advanced materials; and information and communications technologies (covering communications technologies, consumer electronics, integrated circuit design and opto-electronics).
Tier 2 will be proposals submitted under focus themes, including proposals submitted under the Guangdong-Hong Kong Technology Co-operation Funding Scheme (TCFS). Tier 3 will be proposals for innovative applied R&D projects.
"We invited applications for Tier 1 and 2 earlier this year, and we are now inviting applications for Tier 3 of the ITSP. The deadline for submission is March 31, 2006," the spokesman said.
"Potential applicants are reminded to note a number of special requirements and features for this round of applications. Since the Tier 3 project proposals will be more exploratory in nature, the funding requested for each project proposal should not exceed $1 million and the project duration should not exceed one year. As the project proposals are expected to be more innovation and technology driven, industrial sponsorship is not mandatory for the project proposals. Nevertheless, industrial sponsorship is still encouraged and funding priority will be given to applications that have secured cash sponsorship.
"Funding priority will also be given to proposals that are the follow-up projects to, or which leverage on the results of, completed basic research projects undertaken either by the applicant organisation or other local or overseas research institutes.
"Project proposals which would more appropriately be funded under Tier 1 and 2 should not be submitted under the Tier 3 invitation. Applications will be assessed by a panel and only projects with clear potential industrial application and/or exceptional merit such as those with a major technology breakthrough, will be funded," the spokesman said.
He encouraged all eligible parties under the ITSP including local universities, industry support organisations, trade and industry associations, professional bodies and research institutes, to make use of the ITF to carry out innovative applied research and development activities.
Applications for the other three funding programmes under the ITF - the General Support Programme (GSP), the University-Industry Collaboration Programme (UICP) and the Small Entrepreneur Research Assistance Programme (SERAP)- are welcome all year round.
All application proposals for the ITSP must be submitted electronically through the Innovation and Technology Commission Funding Administrative System (ITCFAS) (http://www3.itf.gov.hk/). Under this arrangement, applicant organisations and project coordinators are required to register for access to the relevant application form.
All the relevant documents and information relating to the current invitation of ITSP applications, including the ITSP guidebook and its supplementary note, are available from the ITF website (www.itf.gov.hk). Applicants should note the special requirements and features for this round of ITSP applications as set out in the above website.
Further information can also be obtained from the ITF Secretariat on 20/F, Wu Chung House, 213 Queen's Road East, Wan Chai, Hong Kong or by calling 2737 2229.
Ends/Friday, December 30, 2005
Issued at HKT 15:25
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