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The following is issued on behalf of the Hong Kong Monetary Authority:
Tender Date : June 29, 2016
Bonds available for Tender : 3-year RMB Bonds
Issue Number : BCMKFB16011
Issue Date : July 4, 2016
Maturity Date : July 4, 2019
(or the closest
coupon payment date)
Application Amount : RMB 24,456 million
Issue Amount : RMB 7,000 million
Average accepted Coupon Rate : 2.79 %
Highest accepted Coupon Rate : 2.90 %
(Bonds' Coupon)
Lowest accepted Coupon Rate : 1.80 %
Allocation Ratio : Approximately 54.71 %
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Tender Date : June 29, 2016
Bonds available for Tender : 5-year RMB Bonds
Issue Number : BCMKFB16012
Issue Date : July 4, 2016
Maturity Date : July 4, 2021
(or the closest
coupon payment date)
Application Amount : RMB 11,851 million
Issue Amount : RMB 4,500 million
Average accepted Coupon Rate : 3.12 %
Highest accepted Coupon Rate : 3.25 %
(Bonds' Coupon)
Lowest accepted Coupon Rate : 2.00 %
Allocation Ratio : Approximately 9.48 %
****************************************************
Tender Date : June 29, 2016
Bonds available for Tender : 7-year RMB Bonds
Issue Number : BCMKFB16013
Issue Date : July 4, 2016
Maturity Date : July 4, 2023
(or the closest
coupon payment date)
Application Amount : RMB 3,169.5 million
Issue Amount : RMB 1,000 million
Average accepted Coupon Rate : 3.21 %
Highest accepted Coupon Rate : 3.30 %
(Bonds' Coupon)
Lowest accepted Coupon Rate : 2.50 %
Allocation Ratio : Approximately 43.35 %
****************************************************
Tender Date : June 29, 2016
Bonds available for Tender : 10-year RMB Bonds
Issue Number : BCMKFB16014
Issue Date : July 4, 2016
Maturity Date : July 4, 2026
(or the closest
coupon payment date)
Application Amount : RMB 3,680 million
Issue Amount : RMB 1,000 million
Average accepted Coupon Rate : 3.30 %
Highest accepted Coupon Rate : 3.38 %
(Bonds' Coupon)
Lowest accepted Coupon Rate : 3.00 %
Allocation Ratio : Approximately 35.00 %
*****************************************************
Tender Date : June 29, 2016
Bonds available for Tender : 20-year RMB Bonds
Issue Number : BCMKFB16015
Issue Date : July 4, 2016
Maturity Date : July 4, 2036
(or the closest
coupon payment date)
Application Amount : RMB 1,311 million
Issue Amount : RMB 500 million
Average accepted Coupon Rate : 3.81 %
Highest accepted Coupon Rate : 3.90 %
(Bonds' Coupon)
Lowest accepted Coupon Rate : 3.50 %
Allocation Ratio : Approximately 96.55 %
Ends/Wednesday, June 29, 2016
Issued at HKT 15:45
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