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The Innovation and Technology Commission is now inviting funding applications under the Innovation and Technology Support Programme (ITSP) of the Innovation and Technology Fund (ITF).
The ITSP adopts a three-tier funding framework. This application exercise covers Tier 2 and Tier 3 funding. Tier 2 involves the funding of projects that are industry-oriented and have potential for commercialisation, while Tier 3 involves the funding of exploratory and forward-looking projects. Application forms and the application guides are available at www.itf.gov.hk.
Also invited in this round of funding applications are proposals under the "Green Transportation Technology" theme. Applicants are invited to submit their applications through the Automotive Parts and Accessory Systems (APAS) R&D Centre, which will be the lead applicant for such project proposals. For details of the theme and submission arrangements, please visit the APAS R&D Centre website at www.apas.hk, or call 2788 5311 for enquiries.
The application period commenced today (January 30) and will last until March 28.
Further information on the ITSP funding schemes and application procedures are available on the ITF website and can also be obtained from the ITF Secretariat at 21/F, West Wing, Central Government Offices, 2 Tim Mei Avenue, Tamar, Hong Kong (Tel: 3655 5725; fax: 2957 8726; email: enquiry@itf.gov.hk).
Ends/Wednesday, January 30, 2013
Issued at HKT 14:31
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